-40%
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC
M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC

M.2 NVME NGFF 2280 PCIe SSD Copper Heatsink Radiation Fin for Laptop Notebook PC

$ 4.74

Availability: 128 in stock
  • Condition: New
  • Form Factor: NVME SSD
  • Power Connection: None
  • Return shipping will be paid by: Buyer
  • Model: 2280cu
  • Voltage: None
  • Fan Diameter: None
  • Maximum Airflow Volume: None
  • Compatible Brand: For Acer
  • Restocking Fee: No
  • Type: Passive SSD Cooler
  • Color: Black
  • To Fit: Nvme SSD
  • Material: Copper
  • Packaging: None
  • Custom Bundle: No
  • Bearing Type: None
  • Refund will be given as: Money Back
  • Maximum Fan Speed: None
  • Item must be returned within: 30 Days
  • Fan Light Color: Black
  • Non-Domestic Product: No
  • Brand: SOARINGDRAGON
  • All returns accepted: Returns Accepted
  • Modified Item: No
  • California Prop 65 Warning: None
  • MPN: Does Not Apply
  • Country/Region of Manufacture: China

    Description

    M.2 NVME NGFF 2280 SSD COOLING HEATSINK RADIATION FIN FOR LAPTOP NOTEBOOK PC NEW
    Compatible: M.2 NGFF PCI-E NVMe 2280 SSD
    Color: Black
    Material:
    Anaerobic copper
    Heat sink with 5°C- 15°C cooling effect.
    1. Disassembly and assembly do not require accessories or tools;
    2. Strong heat dissipation in a large area with almost comprehensive coverage;
    3. Suitable for most laptops and small installation scenarios.
    4.
    Heat dissipation coefficient: TU1 3.91W/mK thermal power consumption (TDP): 8W
    5.
    Thermal conductive silicone pad: Laird/Laird TFLEX 530,
    Heat conductivity: 2.8W/mK
    Pls forgive that if any change of products will not make additional specify in advance.
    Package Included: (Heatsink only, not include M.2 SSD)
    1X Heatsink
    1X Laird TFLEX530 Thermal Pad